[圖片]半導(dǎo)體封裝作為芯片制造的關(guān)鍵后道環(huán)節(jié),既關(guān)乎芯片物理保護與電氣連接,更承載著突破制程瓶頸、推動性能升級的重任。從傳統(tǒng)引線鍵合到先進 2.5D/3D 封裝,技術(shù)演進如何重塑產(chǎn)業(yè)鏈格局?國產(chǎn)材料與設(shè)備替代面臨哪些挑戰(zhàn)?Chiplet、SiP 等創(chuàng)新方案又如何改寫芯片設(shè)計規(guī)則?...
特別聲明:以上內(nèi)容(如有圖片或視頻亦包括在內(nèi))為自媒體平臺“網(wǎng)易號”用戶上傳并發(fā)布,本平臺僅提供信息存儲服務(wù)。
Notice: The content above (including the pictures and videos if any) is uploaded and posted by a user of NetEase Hao, which is a social media platform and only provides information storage services.